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Pressure free fabrication of 3D microcomponents using Al powderKIM, Jung-Sik; JIANG, Kyle; CHANG, Isaac et al.Advanced engineering materials (Print). 2006, Vol 8, Num 1-2, pp 38-41, issn 1438-1656, 4 p.Article

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The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperaturesLIMENG YIN; SONG WEI; ZHANGLIANG XU et al.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 4, pp 1369-1374, issn 0957-4522, 6 p.Article

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Mask line roughness contribution in EUV lithographyPRET, Alessandro Vaglio; GRONHEID, Roel.Microelectronic engineering. 2011, Vol 88, Num 8, pp 2167-2170, issn 0167-9317, 4 p.Conference Paper

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